Corning Advanced Packaging Carrier Demo: Load Displacement Comparison

Corning Precision Glass Solutions introduces a new line of glass carriers optimized for fan-out processes, Corning Advanced Packaging Carriers. These carriers feature high stiffness and fine granularity of coefficients of thermal expansion (CTE), which help reduce customers’ challenge of in-process warp by up to 40%. Here we compare a load displacement test of a typical carrier wafer vs. a Corning Advanced Packaging Carrier wafer.

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